2017 IEEE射频集成技术国际研讨会 2017 IEEE International Symposium on Radio-Frequency Integration Technology RFIT

活动简介

The 2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT2017) will be held at The K-Hotel, Seoul, Korea, on August 30- September 1, 2017. This conference is organized and sponsored by the IEEE MTT-S, and will be supported by IEEE MTT-S Seoul Chapter. The Korean Institute of Electromagnetic Engineering and Science (KIEES) is a Technical Co-Sponsor of the RFIT.

征稿信息

重要日期

2017-04-03

初稿截稿日期

2017-05-17

初稿录用日期

2017-06-16

终稿截稿日期

征稿范围

The topics include, but are not limited to, the following technical areas:

Device Technologies: CMOS, SOI, LDMOS, SiGe, GaAs, InP, GaN, MEMS, reliability, characterization, etc.
Modeling and CAD: Active/Passive device modeling, CAD, EM simulation, co-simulation, etc.
Packaging technology: MCM, SiP, TSV, flip chip assembly, wire bonding, anisotropic conductive film, etc.
Passive Circuits and Antenna: on-chip antennas, integrated passive devices, ferrite, piezoelectric material, etc.
Frequency Generation and Conversion ICs: VCOs, PLLs, synthesizers, ADPLLs, frequency dividers/multipliers, mixers, etc.
Front-end RFICs: LNAs, VGAs, phase shifters, RF switches, etc.
Power ICs: power amplifiers, linearization circuits, drivers, etc.
Millimeter-wave and THz ICs: circuits operating at mm-wave (30-300 GHz) and sub-mm-wave (>300 GHz) bands.
Analog and Mixed Signal ICs: ADC, DAC, comparators, filters, AGC/VGA, etc.
High-Speed Data Transceivers: wireless/wireline/optical transceivers, CDRs for high-speed data links.
RF Sensor ICs: automotive radars, wearable devices, security, biomedical and healthcare applications, etc.
Power Transmission ICs: RFIDs, electric coupling, electromagnetic induction, magnetic resonance, wireless power transmission ICs, etc.
1Emerging ICs: power management, digital RF circuits/architectures, RF BIST, reconfigurable and tunable ICs, new energy vehicle electronics EM and ICs, etc.