活动简介

The 2018 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT2018) will be held at the historic Rendezvous Hotel, in Melbourne, Australia from August 15-17, 2018. This conference is sponsored by the IEEE Microwave Theory and Techniques Society.

About RFIT
RFIT is a focused yet interdisciplinary advanced forum for microwave and microelectronics. As an annual event in region 10 solely sponsored by IEEE MTT Society, it rotates among Taiwan, Korea, Australia, Singapore, China, and Japan.

RFIT provides a forum for the integrated circuit and RF technology communities to meet and present the latest developments in integrated circuit design, technology and system integration, with emphasis on wireless communication systems and emerging applications such as biology and healthcare, as well as emerging THz and 3D integration technologies.

RFIT will continue to feature both invited and contributed papers. Distinguished researchers will be invited to deliver keynote speeches and invited talks on technology trends and significant advances. The best papers will be selected from the contributed papers for awards. Both invited and contributed papers that are accepted by RFIT will be submitted to IEEE Xplore. Extended versions of the papers may be submitted to the IEEE Transactions on Microwave Theory and Techniques.

征稿信息

重要日期

2018-04-02
初稿截稿日期
2018-05-14
初稿录用日期
2018-06-14
终稿截稿日期

Papers are invited in the following technical areas

  • Device Technologies: CMOS, SOI, LDMOS, SiGe, GaAs, InP, GaN, MEMS, reliability, characterization
  • Modeling and CAD: active/passive device modeling, CAD, EM simulation, co-simulation
  • Packaging Technology: MCM, SiP, TSV, flip chip assembly, wire bonding, anisotropic conductive film
  • Active Antennas and Passive ICs: on-chip antennas, integrated passive devices, ferrite, piezoelectric
  • Frequency Generation & Conversion ICs: VCOs, PLLs, synthesizers, frequency dividers/multipliers, mixers
  • Front-end RFICs: LNAs, VGAs, phase shifters, RF switches
  • Power ICs: power amplifiers, linearization circuits, drivers
  • Millimeter-wave and THz ICs: circuits operating at mm-wave and sub-mm-wavebands
  • Analog and Mixed Signal ICs: ADC, DAC, comparators, filters, AGC/VGA
  • High-Speed Data Transceivers: wireless/wireline/optical transceivers, CDRs for high-speed data links.
  • RF Sensor ICs: automotive radars, wearable devices, security, biomedical and healthcare applications
  • Power Transmission ICs: RFID, electromagnetic induction, wireless power transmission ICs
  • Emerging ICs: power management, digital RF circuits, RF BIST, reconfigurable ICs, vehicle electronic ICs
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重要日期
  • 会议日期

    08月15日

    2018

    08月17日

    2018

  • 04月02日 2018

    初稿截稿日期

  • 05月14日 2018

    初稿录用通知日期

  • 06月14日 2018

    终稿截稿日期

  • 08月17日 2018

    注册截止日期

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