The 2016 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT2016) will be held at the Howard International House, Taipei, Taiwan, on August 24-26, 2016. This conference is organized and sponsored by the IEEE MTT-S, and will be supported by IEEE MTT-S Taipei Chapter. The Taiwan Electromagnetic Industry-Academia Consortium (TEMIAC) is a Technical Co-Sponsor of RFIT2016.
RFIT is a focused yet interdisciplinary advanced forum for microwave and microelectronics technologies. RFIT is an annual event in region 10 solely sponsored by IEEE MTT Society. It will rotate among Taiwan, Korea, Singapore, China, and Japan, and will be held in end of August or beginning of September every year.
RFIT provides a forum for the integrated circuit and technology communities to meet and present the latest developments in integrated circuit design, technology and system integration, with emphasis on wireless communication systems and emerging applications such as biology and healthcare, as well as emerging THz and 3D integration technologies.
RFIT will continue to feature both invited and contributed papers. Distinguished researchers will be invited to deliver keynote speeches and invited talks on technology trends and significant advances. The best papers will be selected from the contributed papers for awards. Both invited and contributed papers that are accepted by RFIT will appear in the IEEE Xplore, Science Citation Index (SCI) and Engineering Index (EI). Extended versions of the papers can be published in one issue of the IEEE Transactions on Microwave Theory and Techniques subject to the normal review procedure.
The topics include, but are not limited to, the following technical areas:
High-number Spec ICs: high speed/high frequency/high bandwidth/high integration/high performance circuits and systems
Low-number Spec ICs: low power/low voltage/low noise/low complexity circuits and systems
Device Technologies: CMOS, SOI, SiGe, GaAs, LDMOS, GaN, reliability, characterization, CAD, modeling, EM simulation, co-simulation, etc
Packaging technology: MCM, SiP, TSV, MEMS, flip chip assembly, wire bonding, anisotropic conductive film, etc
Passive Circuits and Antenna: on-chip antenna, integrated passive devices, ferrite, piezoelectric material, etc
Frequency Generation ICs: VCOs, PLLs, synthesizers, ADPLL, frequency dividers, multipliers, etc
Building Block RFICs: LNA, PA, mixers, RF front-end, Si-based MMIC, etc
Analog and Mixed Signal ICs: amplifiers, ADC, DAC, comparators, filters, AGC/VGA, etc
RF Sensor ICs: automotive radar, security, wearable devices, biomedical and healthcare applications, etc
Power Transmission: RFIDs, electric coupling, electromagnetic induction, magnetic resonance, wireless power transmission, etc
Emerging ICs: power management, digital RF circuits/architectures, RF BIST, data converters, reconfigurable and tunable ICs, new energy vehicle electronics EM and ICs, etc
08月24日
2016
08月26日
2016
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2018年08月15日 澳大利亚
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