Low Roughness SiC Trench Formed by ICP Etching with Sacrificial Oxidation and Ar Annealing Treatment
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Zheng Changwei  Zhuzhou CRRC Times Semiconductor Co. Ltd.
P /P1 2021年08月27日 12:05~12:10
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Active Magnetic Bearing Amplifier Design based on SiC Devices
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Cao Gang  Huazhong University of Science and Technology
P /P5 2021年08月27日 12:45~12:50
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Design of a High Power Density Bidirectional AC/DC Converter Based on GaN
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Guan Jiajia  Huazhong University of Science and Technology
P /P5 2021年08月27日 12:00~12:05
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High Breakdown Voltage AlGaNGaN HEMT with Graded Fluorine Ion Implantation Terminal in Thick Passivation Layer
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Deng Siyu  University of Electronic Science and Technology of China
P /P1 2021年08月27日 12:00~12:05
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Design Methodology of SiC MOSFET Based Bidirectional CLLC Resonant Converter for Wide Battery Voltage Range
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Liu Mingjie  State Key Laboratory of Advanced Electromagnetic Engineering and Technology, Huazhong University of Science and Technology, Wuhan, P. R. China
P /P5 2021年08月27日 12:25~12:30
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A Low Winding Loss Magnetic Circuit Structure Design of Planar Inductance for GaN-based Totem-Pole PFC
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Ren Pengyuan  School of Electrical Engineering, Xi'an Jiaotong University
P /P2 2021年08月27日 12:30~12:35
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Evaluating Switching Performance of GaN HEMT Using Analytical Modeling
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Wu Yingzhe  University of Electronic Science and Technology of China
P /P2 2021年08月27日 12:15~12:20
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