Off-State Negative Differential Capacitance in Low-Temperature AlGaN/GaN Heterostructures
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Liu Siyu Xidian University
P /P1
2021年08月27日 12:35~12:40
公开 张贴报告
Power Semiconductor IGBT Packaging Technology and Reliability
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Sun Yameng Wuhan University
P /P2
2021年08月27日 12:10~12:15
公开 张贴报告
Deep energy levels investigation on high resistivity bulk monocrystalline diamond
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Wang Yutian Xidian University
P /P1
2021年08月27日 12:15~12:20
公开 张贴报告
Research on A Novel Parallel Resonant DC Link Soft-switching Inverter Based on SiC MOSFET
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Li Si Harbin Institute of Technology
P /P5
2021年08月27日 12:30~12:35
公开 张贴报告
Comparison of the Influence of Reverse Conduction on EMI of WBG And Si Devices
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Zhang Ru School of Electrical Engineering, Xi’an Jiaotong University
P /P4
2021年08月27日 12:00~12:05
公开 张贴报告
A Novel ACDC Single-Phase Bridgeless SEPIC PFC Converter With Reduced Conduction Losses and Simple Structure
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Lin Xiang Shanghai University
P /P5
2021年08月27日 12:55~13:00
公开 张贴报告
Ultra-thin Coupled Inductor for a GaN-Based CRM Buck Converter
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Hua Ming Nanjing Research Institute of Electronics Technology
P /P2
2021年08月27日 12:40~12:45
公开 张贴报告
Degradation mechanism of AlGaN/GaN HEMT based on high temperature reverse bias stress
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Lu Meng Xiangtan University
P /P4
2021年08月27日 12:40~12:45
公开 张贴报告
Mode Switchover Strategy for Multi-port Energy Router Based on State Flow Diagram
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Wei Zhiguo ,China University of Geosciences (Wuhan)
P /P5
2021年08月27日 13:20~13:25
公开 张贴报告
A Dynamic Current Sharing Method in Multi-chip SiC Power Module Using Stacked DBC Bridges and Decoupling Capacitors Based on the Original Simple Module Layout
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Lv Jianwei Huazhong University of Science and Technology
P /P4
2021年08月27日 12:45~12:50
公开 张贴报告
