台湾软体工程研讨会 (Taiwan Conference on Software Engineering; TCSE) 是台湾提供产、官、学、专家与学者,研讨软体工程原理、实务与最新技术发展与研究成果的最主要园地。本次大会的主题为「Software Engineering and Data Science」,将探讨软体工程与资料科学的相关研究,包含应用软体工程技术于资料科学及应用资料科学于软体工程。大会除精选软体工程领域论文以飨与会者之外,更将邀请国内外资料科学软体技术领域的标竿人物与会,欢迎国内外软体工程界精英共襄盛举。本次研讨会将同时召开台湾软体工程学会会员大会。
敬邀学者专家投稿符合(但不限于)下列软体工程主题之论文
Agile software development
Component-based software engineering
Data analysis in software engineering
Data science application in software engineering
Debugging, fault localization, and repair
Dependability, safety, and reliability
Distributed software engineering
Empirical software engineering
Formal methods
Green and sustainable technologies
Middleware, frameworks, and APIs
Mining software engineering repositories
Model-driven engineering
Open source project analysis
Programming languages
Refactoring
Requirements engineering
Reverse engineering
Software architecture
Software engineering education
Software engineering for big data infrastructure
Software engineering for clouds
Software engineering for data product
Software engineering for IoT
Software engineering for mobile app
Software engineering tools
Software evolution and maintenance
Software modeling and design
Software process
Software reuse
Software testing
Software visualization
Specification and modeling languages
Validation and verification
07月07日
2017
07月08日
2017
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