TEI 2017 is the 11th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. It will be held 20th to 23th March 2017 hosted at Keio University in Yokohama, Japan.
The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.
Authors are invited to submit high-quality work detailing original research that contributes to advancing this rapidly developing field. Appropriate topics include but are not limited to:
03月20日
2017
03月23日
2017
初稿截稿日期
初稿录用通知日期
注册截止日期
留言