活动简介

Program

 

Sunday 8/21: Tutorials

  • 8:00 AM – 9:00 AM: Breakfast

  • 9:00 AM – 12:30 PM: Tutorial 1: Using Next-Generation Memory Technologies: DRAM and Beyond

  • 12:30 PM – 1:45 PM: Lunch

  • 1:45 PM – 5:30 PM: Tutorial 2: 3D Depth for Consumers: From Sensors to Apps

  • 5:30 PM – 7:00 PM: Wine and Cheese Reception

 

Monday 8/22: Conference Day 1

  • 8:30 AM – 9:30 PM: Breakfast

  • 9:30 AM – 9:45 PM: Introduction

  • 9:45 AM – 11:15 AM: GPUs and HPC Processors

  • 11:15 AM – 11:45AM: Break

  • 11:45 AM – 1:15 PM: Processing on the Go: Mobile Devices

  • 1:15 PM – 2:30 PM: Lunch

  • 2:30 PM – 3:30 PM: Keynote 1: Augmented Reality

  • 3:30 PM – 4:30 PM: Energy-Efficient Computing: Low-Power SoCs

  • 4:30 PM – 5:00 PM: Break

  • 5:00 PM – 6:30 PM: Vision and Image Processing

  • 6:30 PM – 7:30 PM: Reception

 

Tuesday 8/23: Conference Day 2

  • 7:30 AM – 8:30 AM: Breakfast

  • 8:30 AM – 10:00 AM: Interconnects: Microns to Kilometers

  • 10:00 AM – 10:30 AM: Break

  • 10:30 AM – 12:00 PM: Emerging Embedded

  • 12:00 PM – 1:15 PM: Lunch

  • 1:15 PM – 2:15 PM: Keynote 2:  Are We There Yet? Silicon in Self-Driving Cars.

  • 2:15 PM – 3:15 PM: Many-Core Chips

  • 3:15PM – 3:45 PM: Break

  • 3:45 PM – 5:15 PM: Dealing with Big Data

  • 5:15 PM – 5:45 PM: Break

  • 5:45 PM – 7:15 PM: High-Performance Processors

  • 7:15 PM – 7:30 PM: Closing Remarks

征稿信息

重要日期

2016-03-25
摘要截稿日期
2016-05-02
初稿录用日期
2016-07-18
终稿截稿日期

征稿范围

General Purpose Processor Chips

  • High-Performance and Low-Power

  • Multi-Core and Highly-Reliable Systems

 

Mobile and Embedded Devices

  • Graphics/Multimedia/Game

  • SoC, Security, and DSP chips

 

Communications and Networking

  • Wireless LAN/WAN/PAN

  • Network and IO Processors

 

Other Chips

  • FPGAs and FPGA-Based Systems

  • Memory Technologies and Chipsets

  • Custom Chips for Emerging applications

 

Software for multi-Core and Heterogeneous Systems

  • Programming models, Runtime Systems

  • Compilers and Operating Systems

  • Performance, Power Debug and Evaluation

 

High Integrity Computation

  • Secure architectures

  • Design for validation and test

 

Other Technologies

  • Power and Thermal Management

  • Packaging and Testing

  • Display Technologies

  • On-Chip Optics & Sensors

  • Novel Computing Technologies

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重要日期
  • 会议日期

    08月21日

    2016

    08月23日

    2016

  • 03月25日 2016

    摘要截稿日期

  • 05月02日 2016

    初稿录用通知日期

  • 07月18日 2016

    终稿截稿日期

  • 08月23日 2016

    注册截止日期

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