活动简介

he guiding principles of the World Semiconductor Council explicitly state that ‘markets will be open without discrimination’ amid its efforts to ‘expand international cooperation … to facilitate the healthy growth … from a long-term, global perspective’, and supports free markets of zero tariffs on semiconductor. Globalization is ingrained in the genes of the semiconductor industry. Business operations benefit from zero-tariffs on one hand and mutually prepare themselves for global impacts from competitors on the other. Only with this free air can the semiconductor industry grow healthily. Any national closed-door policies will eventually choke its semiconductor economy to dwindling away. The door of globalization swings in both directions. Therefore, maintaining a stronger position in global markets necessarily calls for deeper rooting of fundamental capabilities over wider spectra of localization. As the semiconductor industry gears itself up for frontal attacks worldwide, it better be prepared to embrace assaults from the rear. The Organizers actively support collaborative efforts among strategic partners to challenge globalization with reinforced localization. This symposium focuses on ecosystem collaborations so that device designers, IP-providers, IC manufacturers, equipment makers, system developers, software vendors, and application creators can harmoniously cohabit synergistically to collectively take on globalization of free markets. Towards this, the Organizers endeavour to bring together all the experts and researchers from different fields in the industries of semiconductor, photovoltaics and solid-state-lighting to share their latest developments, break-through advancements, practical experiences and innovative ideas. Our focus has always been on cross-collaborations, operational strategies, technological innovations, and business partnerships. Any topic with objectives of sustainable development remains as always our principal interest. Presentations on globalization and localization will be highly welcome and facilitated.

征稿信息

重要日期

2016-06-01
摘要截稿日期
2016-06-01
初稿截稿日期
2016-01-20
初稿录用日期
2016-07-31
终稿截稿日期

征稿范围

  • Advanced Lithography

  • Benefits and Justification (ROI, CoO, OEE ...)

  • Business Continuity Plan

  • Contamination Control and Ultraclean Technology

  • Control Architecture/Engineering/IT Infrastructure

  • Cross-industrial Applications of PV/SSL/FPD/…

  • Data Collection/Quality/Storage/Management

  • Design for Manufacturing/Testing/Yield

  • e-Diagnostics, e-Manufacturing, and EEC

  • Engineering/Supply/Value Chains

  • Environment, Safety and Health

  • Equipment Control/Integration

  • Fab Management/Scheduling/Dispatching

  • Factory Design & Automated Material Handling

  • Factory Integration/Operations

  • Factory Physics & Queueing Operations

  • Fault Detection/Classification and Sensors

  • Final/Lean/Green Manufacturing

  • Manufacturing Control and Execution Systems

  • Manufacturing Strategy and Operation Management

  • Next Generation Factory & 450mm Wafers

  • Predictive/Preventive Maintenance

  • Process and Material Optimization

  • Process and Metrology Equipment

  • Process Control and Monitoring

  • Process Modeling and Model-Based Simulations

  • Process/Tool/Sensor Integrations

  • Standards (Equipment, Communications, …)

  • Through Silicon Via & 3D Structures

  • Ultra High Productivity in High-Volume Manufacturing

  • Yield Enhancement and WIP Management

  • Other topics of interests …

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重要日期
  • 09月09日

    2016

    会议日期

  • 01月20日 2016

    初稿录用通知日期

  • 06月01日 2016

    摘要截稿日期

  • 06月01日 2016

    初稿截稿日期

  • 07月31日 2016

    终稿截稿日期

  • 09月09日 2016

    注册截止日期

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