Advances in electro-optic remote sensing technologies now enable measurements to be made in a fraction of the size once required in earlier systems. Miniaturization of critical instrument technologies including optical systems, electronics, mechanisms, cryocoolers and sensors as well as increases in the density of semiconductor electronics and detector arrays now enable instruments to be made significantly smaller while achieving the same or better performance. Additionally, spacecraft technologies including navigation, C&DH, communications, power systems, and structures can be made in a fraction of the size enabling the entire satellite and instrument to be housed in “CubeSats” (where a single “U” is 10x10x10cm), and “NanoSats” where satellites are significantly smaller than traditional but not necessarily in the “U” form factor. These technologies lead to a significant reduction in instrument, spacecraft and launch costs, building robustness into current remote sensing programs and enabling new measurements to be made through more opportunity and through constellations of satellites to improve revisit time. Numerous challenges remain, including achieving legacy performance in a small package, power and data rate limitations, and mission reliability.
This conference is intended to explore all aspects of remote sensing with CubeSats and NanoSats including
Payload Technologies
Instrument systems to support remote sensing of Earth, moon, planets, comets, asteroids
Optics: including telescopes, spectrometers, imagers, etc.
Sensors: UV, visible, infrared, microwave, radar, lidar, fields and particles
Telecom: Satellite-to-satellite, satellite-to-ground communications. High data rate solutions
Electronics: In-flight demonstrations of novel electronic designs and payload electronic architectures
Mechanical Systems: Packaging approaches enabling smaller instruments
Spacecraft Technologies
Power Management: Batteries, solar panels
Communications: Transmitters, receivers
Navigation and Pointing Control: Star trackers, GPS, propulsion
De-orbit Strategies and Technologies
Flight Computers and On-board Signal Processing
Mechanical Aspects: Bus structure, materials, packaging, vibration and thermal control.
08月28日
2016
09月01日
2016
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