征稿已开启

查看我的稿件

注册已开启

查看我的门票

已截止
活动简介

ICPNS'2016, the 8th International Conference on Physical & Numerical Simulation of Materials Processing, will be held on October 14-17, 2016 in Seattle, Washington, USA.

The conference is supported by the National Natural Science Foundation of China (NSFC) and is cosponsored by 20 societies and universities around the world, including those from Australia, Austria, Belgium, Brazil, Canada, China mainland, Croatia, Finland, France, Germany, Hong Kong, India, Japan, Korea, Pakistan, Russia, Sweden, Taiwan, UK and the USA.

This conference series, following the tradition of its seven predecessors in Harbin (1990), Hainan (1997), Beijing (1999), Shanghai (2014), Zhengzhou (2007), China (2010) and  Finland (2013) provides a forum for researchers around the world to present papers on recent advances in the overall field of physical and numerical methods and their applications in thermo-mechanical processing of advanced materials.

征稿信息

重要日期

2016-01-14
摘要截稿日期
2016-04-14
初稿截稿日期

征稿范围

The conference will cover all aspects on Physical and Numerical Simulation of Materials Processing. It will focus on, but not restricted to, the following topics:

1.Physical Simulation and Numerical Modeling of Material Processing, Theories, Developments and Prospects.

2.The Industrial Processes of Welding and Bonding, Heat and Chemical Treatments, Casting, Forging and Plastic Deformation, Powder Metallurgy, High Energy Beam Processing and Other Advanced Processes.

3.Modelling and Simulation in Metallurgical Processing.

4.Software Engineering and Software Development for Material Processing, Computation and Design.

5.Iron and Steels, Nonferrous Alloys, Ceramics, Polymer, Composites.

6.High Temperature Alloys, Aeronautical and Space materials.

7.Ultrafine Grained Materials, Amorphous Materials, Metallic Glasses, High Entropy Alloys.

8.Nano Materials and Nano Technology, Micro-Mechanical Characterization of Materials.

9.Energy Materials, Electronic Encapsulating Materials, Biomaterials, Shape Memory Alloy, Smart Materials, Opto-electronic and Other Functional Materials.

10.Structural and Functional Thin Films, Surface Engineering and Coating.

11.Additive Manufacturing, 3D Print, Processes and Materials.

12.Phase Transformations and Microstructural Evolution.

13.Material Design Approaches and Experiences, Computation Materials Science and Molecular Dynamics Simulation, Artificial Neural Network and Expert System on Material Processing.

14.Material Behavior Characterization, at Nanoscale or in Extreme Condition.

15.Sustainability through Materials Processing and Waste Valorization.

16.Non Destructive Test of Materials.

17.Prediction and Evaluation on Structure and Performance of Materials.

18.Fatigue in Materials: Fundamentals, Multiscale Modeling and Prevention.

留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    10月14日

    2016

    10月17日

    2016

  • 01月14日 2016

    摘要截稿日期

  • 04月14日 2016

    初稿截稿日期

  • 10月17日 2016

    注册截止日期

主办单位
美国普渡大学
承办单位
美国普渡大学
联系方式
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询