2018 e-Manufacturing & Design Collaboration Symposium eMDC

活动简介

The accumulations of advancements in computational algorithms, computing powers and dynamic memory spaces during the past two decades, have succinctly reached a threshold that, with the final championship of machine over human at the most ancient strategic game of civilization, a new era of intelligent manufacturing has dawned in the semiconductor industry world-wide. The ultimate distillation process over integrated networks, from raw data to pixel information to packet knowledge to consolidated intelligence, has blossomed in uncharted wild fields with human imagination as the only limit.

Coupled with notions of Industry 4.0 with its cyber-physical systems over Internet of Things, from self-driving vehicles to nano-robot farms to self-fabricated devices in all kinds of realities, virtual or augmented, how to realize their impacts in the manufacturing processes bears critical importance on further advancements of the semiconductor industry. Four different aspects of innovative creations are identified: Engineering, Manufacturing, Business and Artificial intelligence, for crystallizing the magic balls.

TSIA/SEMI/GSA endeavour to bring together all the experts and researchers from different fields to share their latest developments, break-through advancements, practical experiences and innovative ideas. Our focus has always been on cross-collaborations, operational strategies, technological innovations, and business partnerships.

征稿信息

重要日期

2018-06-01

摘要截稿日期

2018-06-01

初稿截稿日期

2018-06-20

初稿录用日期

2018-07-31

终稿截稿日期

The Symposium attends to recent technological advancements to align the needs of designers, manufacturers, equipment suppliers, software vendors, solution providers and researchers. It offers a public arena for the exchange of up-to-date experiences among manufacturers for adoption of technological developments. With green notions of supply/engineering/value chains, coverage of the joint symposium includes, but not limited to, the following topics of interests:

•Advanced Lithography
•Autonomous Devices / Smart Systems
•Benefits and Justification (ROI, CoO, OEE ...)
•Big Data / Analytics / Machine Learning / AI
•Business Continuity Plan/Risk Management
•Contamination Control and Ultraclean Technology
•Control Architecture/Engineering/IT Infrastructure
•Cross-industrial Applications of PV/SSL/FPD/…
•Data Collection/Quality/Storage/Management
•Design for Manufacturing/Testing/Yield
•e-Diagnostics, e-Manufacturing, and EEC
•Engineering/Supply/Value Chains
•Environment, Safety and Health
•Equipment Control/Integration
•Fab Management/Scheduling/Dispatching
•Factory Design & Automated Material Handling
•Factory Integration/Physics/Operations/Queueing

•Fault Detection/Classification and Sensors
•Final/Lean/Green/Smart/Intelligent Manufacturing
•Green Energy / Sustainability
•Industry 4.0/Internet of Things
•Manufacturing Control and Execution Systems
•Manufacturing Strategy and Operation Management
•Predictive/Preventive Maintenance
•Process and Material Optimization
•Process and Metrology Equipment
•Process Control and Monitoring
•Process Modeling and Model-Based Simulations
•Process/Tool/Sensor Integrations
•Standards (Equipment, Communications, …)
•Through Silicon Via & 3D Structures
•Ultra High Productivity in High-Volume Manufacturing
•Yield Enhancement and WIP Management
•Other topics of interests …