The topics of the MIXDES  Conference include:

1. Design of Integrated Circuits and Microsystems
   Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
2. Thermal Issues in Microelectronics
   Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.
3. Analysis and Modelling of ICs and Microsystems
   Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.
4. Microelectronics Technology and Packaging
   New microelectronic technologies. Packaging. Sensors and actuators.
5. Testing and Reliability
   Design for testability and manufacturability. Measurement instruments and techniques.
6. Power Electronics
   Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
7. Signal Processing
   Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
8. Embedded Systems
   Design, verification and applications.
9. Medical Applications
   Medical and biotechnology applications. Thermography in medicine.