2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS

活动简介

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is sponsored by the IEEE Electronics Packaging Society.

征稿信息

重要日期

2018-07-02

摘要截稿日期

2018-07-02

初稿截稿日期

2018-08-15

初稿录用日期

2018-08-31

终稿截稿日期

System-level, board-level, package-level and on-chip interconnects
High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
RF/microwave/mm-wave packaging structures and components, antenna-in-package and RFIC co-design, mixed signal modules and wireless switches
Signal and thermal integrity
Power integrity and power distribution networks
Low power mobile and personal applications
Memory and DDR interfaces
Jitter and noise management
Electronic packages and microsystems
Heterogeneous integration, 2.5D/3D interconnects and packages, TSVs and MCMs
Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools, and flows
Macromodeling and model order reduction as it applies to electrical analysis
Advanced and parallel CAD techniques for signal, power, and thermal integrity analysis
Measurement and data analysis techniques for system‐level and on‐chip structures.