Latest serial applications in the MID technology and the increasing range of innovative manufacturing solutions for molded interconnect devices strongly emphasize the growing market success of this technology. Innovative assembly and equipment producers of MID technology record significant growth rates. The direct application of the electronic on various three-dimensional substrates offers versatile design and rationalization potentials for mechatronic systems.

Up-to-date information and expert discussions can set major impulses for the successful implementation of this innovative and interdisciplinary technology as well as for a stable assessment of the growth areas. The conferences about MID technology in the metropolitan region Nuremberg have established themselves as international most significant forum about this technology.

Experts of industry and research are invited, to present a paper on the topics listed bellow:

1. Innovation with MID
2. MID - Implementation and Realization
3. Integrated CAD / CAM Systems
4. Materials for MID
5. Plastics Processing
6. Metallization
7. Structuring of Circuit Paths
8. 3D Assembly
9. Quality Assurance
10. Printed Electronics 
11. Future Trends

In the congress-program there will be a distinction between an Industrial Track and an Scientific Track.

• Industrial Track:

Lectures with industrial focus.

The lectures in the Industrial Track are to be held in english language. A simultaneous translation won't be provided.

The congress-posts will be published in the proceedings in form of the presentation-slides. The submission of formulated posts (papers) is optional.

• Scientific Track:

Lectures with scientific focus.

The lectures in the Scientific Track are to be held in english language too. A simultaneous translation won't be provided.

The congress-posts will be published in the proceedings in form of the presentation-slides. Furthermore scientific papers, which will be reviewed by the program committee, are to be submitted.

The scientific proceedings containing all accepted full papers related to the congress contributions will be published. Additionally to the publication in our scientific proceedings, selected full papers will be forwarded and recommended to acknowledged periodicals / journals e.g. publication platforms of “Springer Verlag”, following to the congress.