Advances in high-speed integrated circuit technologies led to various new applications for millimetre-wave systems in communication and radar. Besides requiring fast active elements, millimetre-wave systems make heavy demands on assembly precision, materials and technologies, all needed for low loss connections from the MMIC to the operating environment. This workshop will highlight advances and limitations of various techniques available to route millimetre-wave signals to/from MMIC. Presentations will include different aspects of bonding technologies, such as wire-bonds, ribbon bonds, flip-chip bonds, as well as direct connections between the MMIC and non-planar waveguides. In addition, packaging of millimetre-wave chips is discussed. In a first presentation, flip-chip interconnects operating up to 500 GHz are presented by the FBH institute, Berlin. Thereafter, performance of advanced wire-bonds at millimetre-waves and the characteristics of CMOS on-chip antennas are discussed by Tel Aviv University. Next, Fraunhofer IAF, Freiburg, discusses low-loss on-chip transmission lines and shows novel concepts to couple chips directly to the rectangular waveguide fundamental mode by means of on-chip field probes. In the second half of the workshop, Northrop Grumman brings more aspects of direct coupling from on-chip dipoles to rectangular waveguide, including waveguides made by DRIE. Then, Infineon presents concept and advanced features of the embedded wafer level ball grid array (eWLB) package for millimetre-wave applications. Finally, University of Stuttgart discusses coupling from chip to dielectric or metallic waveguide by means of on-chip resonators.