Effect of surface oxidation on the SiV PL properties in the nanocrystalline diamond films
2021表面工程国际会议(第8届)
杨 兵  中国科学院金属研究所
暂无会场信息
仅限参会人 口头报告
Analysis of the influence of vibration and thermal vibration coupling on the power module
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Guan JiaJia  Huazhong University of Science and Technology
Room1 /S1&S2 2021年08月27日 10:00~10:15
仅限参会人 口头报告
Improved Breakdown Characteristics for AlN/GaN/InGaN Coupling Channel HEMTs with SiNx Removal and Backfill Technique
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Lu Hao  School of Microelectronics, Xidian University
Room2 /S5&S6 2021年08月27日 08:45~09:00
仅限参会人 口头报告
Soft-Switching Resonant Active Clamp Flyback based-on GaN HEMTs for MHz High Step-Up Applications
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Meng Wuji  Nanjing University of Aeronautics and Astronautics
Room2 /S7&S8 2021年08月27日 14:00~14:15
仅限参会人 口头报告
Analysis of GaN HEMT Degradation under RF Overdrive Stress
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Chen YiQiang  The No.5 Electronics Research Institute of the Ministry of Industry and Information Technology;Xie YuHan  ,South China University of Technology
Room1 /S1&S2 2021年08月27日 09:45~10:00
仅限参会人 口头报告
Characteristics of SiC MOSFET in a Wide Temperature Range
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Zhu Mengyu  Xi'an Jiaotong University
Room1 /S1&S2 2021年08月27日 10:45~11:00
仅限参会人 口头报告
Comparison Study of Parasitic Inductance, Capacitance and Thermal Resistance for Various SiC Packaging Structures
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Zhang Yifan  Huazhong University of Science and Technology
Room1 /S3&S4 2021年08月27日 15:30~15:45
仅限参会人 口头报告
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