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我的稿件
186
Remining Useful Life Prediction Using Neural Networks for Rolling Bearing全文被拒

KingShao*

Special Sessions > SS01 AI for Failure Analysis and Reliability of Integrated Circuit(IC)

178
A novel prediction method for gear friction coefficients based on a computational inverse technique全文被拒

liuhuayun*

Special Sessions > SS01 AI for Failure Analysis and Reliability of Integrated Circuit(IC)

176
A novel evolution model of pitting failure and effect on time -varying mesh全文被拒

liuhuayun*

Special Sessions > SS01 AI for Failure Analysis and Reliability of Integrated Circuit(IC)

174
A novel estimation method of friction coefficient for evaluating gear pitting fault全文被拒

liuhuayun*

Special Sessions > SS01 AI for Failure Analysis and Reliability of Integrated Circuit(IC)

172
A new tooth pitting modeling method based on matrix equation for evaluating time-varying mesh stiffness全文被拒

liuhuayun*

Special Sessions > SS01 AI for Failure Analysis and Reliability of Integrated Circuit(IC)

171
A novel federated transfer learning strategy for bearing cross-machine fault diagnosis全文被拒

LuQi, LiuYongbin*

Special Sessions > SS01 AI for Failure Analysis and Reliability of Integrated Circuit(IC)

168
Interpretable feature graph response and inference network for complex defect detection of flip chip全文录用

ZhangSiyu, LiKe*, LiFucai

Special Sessions > SS01 AI for Failure Analysis and Reliability of Integrated Circuit(IC)

161
Wafer Defect Detection Based on YOLO-BA终稿

ShuXiaotong, LuXiangning*, XuLin, HeZhenzhi, ShengLianchao, YeGuo

Special Sessions > SS01 AI for Failure Analysis and Reliability of Integrated Circuit(IC)

130
Re-weighted constrained feature characterization method study for flip chip solder joint vibration signals终稿

SunYu, SuLei, GuJiefei, ZhaoXinwei, LiKe*, PechtMichael, ChenXixin, ZhangLei

Special Sessions > SS01 AI for Failure Analysis and Reliability of Integrated Circuit(IC)

124
Capacitor array bonding defect detection based on active infrared thermography全文录用

HuangYifan, SunBo, LiaoGuanglan*, QinQi, SongZixian, NieLei, LiuZhiyong

Special Sessions > SS01 AI for Failure Analysis and Reliability of Integrated Circuit(IC)

88
A Dual-Constraint Centroid Contrastive Prototypical Network for Flip Chip Defect Detection Under Limited Labeled Data全文录用

LouYunxia, LiKe*, SuLei, GuJiefei, ZhaoXinwei, PechtMichael

Special Sessions > SS01 AI for Failure Analysis and Reliability of Integrated Circuit(IC)

    11 条记录 1/1页
重要日期

  • 会议日期

    10月31日

    2024

    至

    11月03日

    2024

  • 09月30日 2024

    初稿截稿日期

  • 11月12日 2024

    注册截止日期

主办单位
Anhui University
Xi’an Jiaotong University
Harbin Institute of Technology
IEEE Instrumentation & Measurement Society
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