报告详情
  1. 活动首页
  2. 报告清单
  3. 报告详情
Crack opening shape reconstruction method in magnetic flux leakage imaging
编号：8 访问权限：公开 更新：2022-12-17 09:43:06 浏览：507次 张贴报告

报告开始：暂无开始时间（Asia/Shanghai）

报告时间：暂无持续时间

所在会场：[暂无会议] [暂无会议段]

演示文件
摘要
Magnetic flux leakage (MFL) is widely used to detect ferromagnetic materials. In the study of the reconstruction of cracks, the opening crack profile reconstruction method is the first and crucial step. However, current research concerns little about the reconstruction of the opening profile. This paper proposed an opening profile reconstruction method by introducing the Newton-Raphson and iterative Tikhonov regularization method. And the solenoid model applicable to the derivation of magnetic fields with complex defects is presented as an analytical forward model of magnetic fields. The sensitivity matrix of the analytical model of the magnetic field is adapted by improving the differential method of the magnetic field. The comparative experimental results show that this method has good results for defect profile reconstruction in MFL inspection and has apparent advantages in accuracy compared with the traditional defect profile segmentation method.
 
关键词
nondestructive testing, magnetic flux leakage, opening shape reconstruction, Newton-Raphson, iterative Tikhonov regularization
报告人
Shengping Li
uestc

Shengping Li received the B.S. degree and master's degree from University of Electronic Science and Technology of China, Chengdu, China, in 2018 and 2021. He is currently working toward the Ph.D. degree in the School of Automation Engineering, University of Electronic Science and Technology of  China, Chengdu. His research interests include nondestructive testing, sensor signal processing.

发表评论
验证码 看不清楚，更换一张
全部评论
重要日期

  • 会议日期

    11月30日

    2022

    至

    12月02日

    2022

  • 11月30日 2022

    初稿截稿日期

  • 12月24日 2022

    报告提交截止日期

  • 04月13日 2023

    注册截止日期

主办单位
Harbin Insititute of Technology
China Instrument and Control Society
Heilongjiang Instrument and Control Society
Chinese Institute of Electronics
IEEE I&M Society Harbin Chapter
联系方式
登录查看完整联系方式
历届会议
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询