Molecular simulation technique can reveal the pattern between macroscopic properties and microstructure of polymers, so this technique is widely used in the design of molecular structures of high-performance epoxy resins. In this paper, an epoxy resin cross-linking system is constructed based on molecular dynamics simulation method, and the curing cross-linking reaction between epoxy resin and methyl tetrahydro phthalic anhydride is simulated. By changing the electric field strength and ambient temperature, the effect of both on the epoxy resin is investigated. The results show that the ambient temperature has a significant effect on the energy and elastic modulus of the epoxy resin, and the increase in temperature causes the epoxy resin to become softer and its mechanical properties to decrease. And the electric field strength has a significant effect on the elastic modulus of the epoxy resin.

composite insulator;epoxy resin;molecular dynamics;electric field strength;temperature