Bi2Te3/Ti3C2Tx nanocomposites and its thermoelectric properties study
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摘要
In this paper, Bi2Te3 nanosheets were firstly synthesized by solvothermal method, and then Ti3C2Tx (indicating O, F, OH, etc.) was introduced into bismuth telluride nanosheets with good thermoelectric properties as the second phase by the composite method of "ultrasonic dispersion-flash freeze-freeze-drying" combined with discharge plasma sintering technique, and the Bi2Te3/Ti3C2Tx nanocomposites were successfully prepared. The effects of different contents of Ti3C2Tx on the thermoelectric properties of Bi2Te3/Ti3C2Tx nanocomposites were also investigated. The samples were characterized and performance tested using scanning electron microscope, transmission electron microscope, thermoelectric test system, and laser thermal conductivity meter. The results show that the introduction of titanium carbide into the bismuth telluride nanomatrix increases the carrier concentration of bismuth telluride, leading to an increase in conductivity and a decrease in Seebeck coefficient, but the energy barrier scattering at the composite interface avoids a significant decrease in Seebeck coefficient; the nanocrystalline boundary between titanium carbide and bismuth telluride increases phonon scattering and interfacial thermal resistance and decreases thermal conductivity. The 1 vol% bismuth Bi2Te3/Ti3C2Tx nanocomposites showed a 25% increase in thermoelectric figure of merit compared to the bismuth Bi2Te3 nanomatrix. 1 vol% Bi2Te3/Ti3C2Tx nanocomposites had the highest ZT value of 0.908 at 432 K and the average ZT value of 0.87 in the range of 376-511 K.
 
关键词
Bi2Te3/Ti3C2Tx nanocomposites; Solvothermal method; ZT value; Thermoelectric performance.
报告人
Xinwei Liang
重庆市沙坪坝区沙正街174号 重庆大学电气工程学院

稿件作者
Xinwei Liang 重庆市沙坪坝区沙正街174号 重庆大学电气工程学院
正勇 黄 重庆市沙坪坝区沙正街174号重庆大学电气工程学院
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重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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