electrical contact thermal defect prediction of power transformation equipment based on 3D mechanical-electromagnetic-thermal coupling field
编号:358 访问权限:仅限参会人 更新:2022-09-23 17:57:22 浏览:115次 张贴报告

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摘要
To make a deep investigation into the temperature distribution characteristics of the electrical joint overheat defect, a 3-D simulation model based on the mechanical-electromagnetic-thermal coupling field is established. The four-hole plane joint is selected as an example, the influence of the contact pressure on the interface electrical conductivity is considered, and the convective heat transfer between the joint and the air outside is included. Based on this model, the current distribution characteristics and the main area of temperature rise of the joint are explored. The results can provide simulation support for the modeling of equipment level digital twin of the electrical joint.
关键词
Overheat Defect;Mechanical-Electromagnetic-Thermal Coupling Field;Electrical Joint;Simulation Analysis
报告人
Jinghui Ruan
State Grid Hunan Electric Power Corporation Research Institute

稿件作者
Jinghui Ruan State Grid Hunan Electric Power Corporation Research Institute
Ping Peng State Grid Hunan Electric Power Corporation Research Institute
Lezhi Ou State Grid Hunan Electric Power Corporation Research Institute
Yongheng Zhong State Grid Hunan Electric Power Corporation Research Institute
Yun Liu State Grid Hunan Electric Power Corporation Research Institute
Sheng Hu State Grid Hunan Electric Power Corporation Research Institute
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重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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