MMC Power Device Loss and Junction Temperature Calculation Considering Junction Temperature Feedback
编号:357 访问权限:仅限参会人 更新:2022-08-29 15:58:23 浏览:117次 张贴报告

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摘要
The accurate calculation of loss and junction temperature of modular multilevel converter (MMC) is an important basis for device selection, life prediction and reliability analysis of flexible DC transmission system. These instructions give you basic guidelines for preparing papers for conference proceedings. Currently, the commonly used loss and junction temperature calculation uses the fixed junction temperature method, which has some errors with the actual situation. An MMC power device loss and junction temperature calculation method considering the junction temperature feedback method is proposed in this paper. The power device loss distribution is analyzed from the operating mode of the half-bridge sub-module, and then the junction temperature feedback calculation method is introduced in detail on the basis of the fixed junction temperature loss calculation method. The loss and junction temperature calculation relative errors of fixed junction temperature method and junction temperature feedback method are analyzed by using the actual converter station MMC system as the calculation example. The distribution characteristics of loss and junction temperature in MMC submodules under different operating conditions are also analyzed. The proposed method can be used as a reference for the loss evaluation of high-voltage and large-capacity flexible DC transmission systems.
关键词
Modular multilevel converter,Loss,Junction Temperature,Feedback
报告人
Rongliang Zheng
Chongqing University

稿件作者
Rongliang Zheng Chongqing University
Youyuan Wang Chongqing University
Weirong Qian Chongqing University
Li Liu State Grid Zhoushan Power Supply Company
Enke Yu State Grid Zhoushan power supply company
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重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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