Study on damage mechanism of PPLP under cavity discharge development in liquid nitrogen based on Molecular Dynamics
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摘要
Polypropylene laminated paper (PPLP) is an important type of insulating material used in High-temperature superconducting (HTS) cables. However, partial discharge (PD) is found to be a key indicator to reveal the state of the insulation system. During the operation of HTS cable, PPLP insulation material is vulnerable to the combined effect of electrical, thermal and mechanical stress, resulting in insulation aging, cracking and even insulation failure. In order to analyze the damage mechanism of insulation materials caused by cavity discharge from the micro perspective and atomic level, molecular simulation technology was introduced. In this paper, the micro-reaction of molecular model under electric field was simulated based on Materials Studio DMol3/Dynamics module, and the changes of molecular energy under different external electric fields were studied. Meanwhile, the cellulose molecular motion and pyrolysis of PPLP surface insulation paper were explored, and the microscopic reaction mechanism was revealed from the atomic level. The results show that: (1) The LUMO-HOMO energy gap can be used to represent the structural stability between molecules. The larger the electric field is, the smaller the LUMO-HOMO energy gap is; (2) The outer insulation paper cellulose (C-O-C) bond breaks under the impact of high energy electrons, and the intermolecular force decreases; (3) Cellulose molecular decomposition products include CO2, CO, CHO2,C2H4O2 and small molecule free radicals. This paper reveals the damage mechanism of PPLP from the micro perspective, which has potential application value in the fault diagnosis of superconducting cables.
关键词
Cellulose;degradation;Molecular Dynamics
报告人
Xiao Shao
Chongqing University of Technology

稿件作者
Xi Chen Chongqing University of Technology
Xiao Shao Chongqing University of Technology
Tianyan Jiang Chongqing University of Technology
Maoqiang Bi Chongqing University of Technology
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重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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