Comparative Evaluations and Failure Modes of Wire- Bonding Packaged SiC, Si, and Hybrid Power Modules摘要待审

Li Ran, Zheng Zeng*, Weihua Shao, Hao Chen, Xiaoling Li

全体主题 > Packaging, power modules, and ICs

test摘要待审

全体主题 > Packaging, power modules, and ICs

Industrial Robotic Claw for Cottage Industries摘要待审

Mursal Furqan*, Mahaveer Rathi

全体主题 > Packaging, power modules, and ICs

A Novel Cascode GaN Switch Integrating Paralleled GaN DHEMTs for High-Power Applications终稿

Tianhua ZHU*, Fang ZHUO, Feng WANG, Hailin WANG, Xinlu HE, shuhuai SHI

全体主题 > Packaging, power modules, and ICs

A SiC MOSFET based High-voltage Series-connected Devices终稿

xijun ni*

全体主题 > Packaging, power modules, and ICs

A 2.6GHz Class-AB GaN Power Amplifier with Maximum Output Power of 56W Achieving 70% Power Added Efficiency终稿

Zeqiang Chen, Ken Li, Kai Jin, Chenxi Huang, Peng Li, Li Geng*

全体主题 > Packaging, power modules, and ICs

High Efficiency Quasi Class-J GaN PA with 1.8-3.0GHz Bandwidth终稿

Chenxi Huang, Zeqiang Chen, Li Geng*, Qin Xia, Peng Li

全体主题 > Packaging, power modules, and ICs

Vibrational Energy Harvesting System with MPPT for IoT Applications终稿

wei gou, shiquan fan*, li geng

全体主题 > Packaging, power modules, and ICs

A Phase-Leg Full SiC Power Module Used in Vienna Rectifiers终稿

cheng zhao, Wang Laili*

全体主题 > Packaging, power modules, and ICs

A Novel Packaging Method Using Flexible Printed Circuit Board for High-Frequency SiC Power Module终稿

Yang Fengtao, Wang Laili*, Cheng Zhao, Qi Zhiyuan, Wang Jianpeng, Zhang Yang, Chen Yang

全体主题 > Packaging, power modules, and ICs

Gate drive Design for a Hybrid Si IGBT/SiC MOSFET Module终稿

Puqi Ning*, Lei Li

全体主题 > Packaging, power modules, and ICs

Novel Silicon Carbide Integrated Power Module for EV application终稿

Bassem Mouawad*, Jordi Espina, Jianfeng Li, Lee Empringham, christopher Johnson

全体主题 > Packaging, power modules, and ICs

The Thin Plate Heat Pipe Koch Fractal Wick Structures Investigation终稿

Quan Hu, Yunqian Song, Jun Liu, Zhenyu Wang*, Binbin Jiao, Rong Gao

全体主题 > Packaging, power modules, and ICs

Optical Coherence Tomography-Based IGBT Non-Destructive Testing终稿

ZHIYI ZHAO*, Yihua Hu, Yaochun Shen, Chengmin Li, Wuhua Li, Weifeng Hu

全体主题 > Packaging, power modules, and ICs

Comparative Packaging Evaluation and Failure Mode Analysis of SiC, Si, and Hybrid Power Modules终稿

全体主题 > Packaging, power modules, and ICs